| PART |
Description |
Maker |
| CT1210KXXG |
Multilayer technology
|
EPCOS
|
| MLVS0603M07 MLVS0603M04 MLVS0603M06 MLVS-0603 MLVS |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP
CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
| 20726 |
3DNow! Technology Manual AMD-K6 Processor Multimedia Technology 3DNow！？技术手册的AMD - K6处理器多媒体技
|
Cypress Semiconductor Corp.
|
| SIGC81T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| B72587E3140S200 B72588G3140S200 B72547E3140S200 SR |
Combination of a multilayer ceramic capacitor and a multilayer varistor, leaded
|
EPCOS[EPCOS]
|
| PIC18F4585-P PIC18F4585-I |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| CR1209X7R104Z3F5 CR1209X7R104Z3NG5 CR1209X7R104Z3F |
CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 1209 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00047 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0056 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0022 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.0012 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.001 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0015 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP
|
Presidio Components, Inc.
|
| SIGC25T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip short circuit prove
|
Infineon Technologies AG
|
| PIC18F4680 PIC18F4585 PIC18LF4680-I301 PIC18LF4680 |
Enhanced Flash Microcontrollers with ECAN? Technology, 10-Bit A/D and nanoWatt Technology
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
| HDG320240 320240 |
Chip On Glass technology 320 X 240 Dots Graphics
Chip On Glass technology 在玻璃芯片技
|
List of Unclassifed Manufacturers
ETC[ETC]
Hantronix,Inc
Electronic Theatre Controls, Inc.
|
| 05006-BP1R2CDU-R 05006-BP1R5CDU-R 05006-BP1R8ADU-R |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000018 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000001 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000022 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000005 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
|
Vishay Intertechnology, Inc.
|
|
